Orúkọ-kọ́-aládàn:
Hefei Youth Innovation Park Project ode Aṣọ odi
Awọn ọja ti a lo:
40mm nipọn sihin plug-ni PC ṣofo dì
Agbegbe to wulo:
5300㎡
Akoko rira:
2022.9
Idojukọ lori iṣelọpọ PC / PMM ati sisẹ jason@mclsheet.com +86-187 0196 0126
Hefei Youth Innovation Park Project ode Aṣọ odi
2024-04-01
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Songjiang Agbegbe Shanghai, China
Olubasọrọ: Jason
Tẹli: +86-187 0196 0126
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